ECPA to host European co-packers conference
The event will take place at the NH Hotel du Grand Sablon in Brussels, Belgium and will cover a comprehensive range of topics during a two day programme that starts on October 8th and finishes on the 9th.
First ever pan-European co-packing event
“The ECPA Conference will be the very first pan European event for the co-packing industry,” the body’s official release on the event states.
“As such it will offer a unique platform for business leaders and decision makers across the value chain to meet, network, acquire new knowledge and information and exchange views and opinions about the future of this industry.”
The title of the conference is ‘Mapping out the World of Co-Packing in Europe’, and the programme has been designed to target a range of co-packing professionals from throughout Europe.
According to the organisers, this will include a comprehensive survey of its members to discover the most pressing industry issues and topics, and in particular the size and composition of the market.
Conference programme to include sector survey results
Besides the survey results, other presentations will also touch on topics such as quality assurance, shelf-ready packaging, ERP as well as the growing importance of the outsourcing of strategic business processes by brand manufacturers and private label owners – the organisers say.
The presentations will be given by a range of top-level co-packing industry professionals from all segments of the industry, who will be sharing the professional insight in various areas of expertise.
The conference programme will be moderated by Rodney Steel, chief executive of the British Contract Manufacturers and Packers Association (BCMPA), while the programme itself will feature Jason Tham, director of the Board of the American Contract Packaging Association.
The event will be rounded off by a panel discussion between industry and association leaders who will be taking an in depth look at trends, challenges and areas of common interest to the sector.
